Introduction

Lead Free Solder Paste Sn96.5 / Ag3 / Cu0.5 is an air re-flow, no clean solder paste, specially formulated to accommodate the higher processing temperature required by Sn / Ag - Pb Free Alloy systems favored by the electronic industry to replace conventional Pb bearing solders. The Product formulation offers consistent repeatable printing performance combined with a long Stencil and Tack Time.

Alloy

BT Uses Low Oxide spherical powder composed of Sn / Ag in a standard type - III Mesh Size.  The weight ratio of the flux to solder powder is referred to as the metal load typically in the range of 90% for standard alloy.

Storage And Handling

Refrigerated storage will prolong the shelf life of Solder Paste. The shelf life of the paste is 6 months. Solder Paste should be allowed to reach ambient working temperature prior to use. Generally paste should be removed from refrigeration at least 2 hrs before use. 

Re-Flow

This profile is designed for use with Sn96.5/Ag3.5. It will serve as general guideline in establishing a re-flow profile. Adjustments to this profile may be necessary based on specific process requirements.

Product Specification

MATERIAL: 96.5/3/0.5 Sn/Ag/Cu Solder Paste. 

TYPE: No Clean

REFERENCE SPECIFICATION: ANSI-J-STD-004

Physical Properties

STANDARD ALLOY: 96.5 / 3 / 0.5

POWDER MESH SIZE / SHAPE: -325 + 500, 25 Microns, Spherical, TYPE-III

METAL CONTENT: 90%

FLUX PERCENT: 10%

Other Parameters

CORROSION: Passes Copper Mirror Corrosion Test

HALIDE DETECTION TEST: Passes Chromate Paper Test

HALIDE CONTENT: NIL

INSULATION RESISTANCE: SIR 7 DAYS @ 85 C 85% RH-10" Mega OHMS

SOLUBILITY / WASHABILITY: ISO Propyl Alcohol

STORAGE: Store in Refrigeration @ 15° C

SHELF LIFE: 6 Months Under Refrigeration